Dicing

Wafer dicing is the process by which the wafers are seperated into single chips (die).
With us you can order diced wafers or you can return your processed wafers to us and we dice them afterwards.

Materials:
Silicon, Glass, Quartz, Sapphire, Germanium etc.

 
Impressions:

tl_files/images/Dicing.jpg

tl_files/images/wafer dicing.jpg

 

<< back