SOI Wafers

 
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Typical SOI-Wafer Specifications:

Diameter
3" (76.2 mm)
100 mm
125 mm
150 mm
200 mm

Device Layer
380 nm - 100 µm

BOX Layer
100 nm - 10 µm

Handle Layer
300 µm - 775 µm

Bonding Methods
Direct-Bonding
Epi-Layer-Transfer
Oxygen Implantation

Other Materials
SOG, GOS

 

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