Services

Grinding and Polishing, Reclaim
Only Silicon Wafers

Special Grinding Services
such as grinding centric pockets with smaller diameters (pocket Wafers)

Dicing
In various formats
Silicon-,
Glass, Quartz, Sapphire, ...
 
>> more information about dicing service  

Laser Processing
scribing, marking, cutting

Coatings
Metalizatios
PVD / CVD / Electroplating / Evaporating
Dry or Wet Thermal Oxide
Low Temperatore Oxide (LTO)
TEOS SiO2

LPCVD Nitride
PECVD Nitride
Polysilicon
Photoresist
Anti Sticking Layer
ITO (Indium tin oxide)

Removing SiO2 from wafer back side
by protecting the front side and HF-Dip

Lithography
E-Beam
UV Nanoimprint
Optical Contact Lithography

Wafer seperating
for as few as only one wafer from our stock

Metrology
SEM
AFM
STM
MFM
GDMS
 
Type- & Resistivity- check
Ellipsometry


more Services on request