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Services

Schleifen, Polieren, Grinding, Polishing, Reclaim

Grinding and Polishing, Reclaim
Only Silicon Wafers

Spezielle Schleifarbeiten Special Grinding Services

Special Grinding Services
such as grinding adapter pockets with smaller diameters (pocket Wafers)

Trennschleifen, Formatieren, Dicing

Dicing
Formating Wafers into small Chips
Materials: Silicon-, Glass, Quartz, Sapphire, ...

Laserbearbeitung Laser Processing

Laser Processing
scribing, marking, cutting

Beschichtungen Coatings

Coatings
Metalizatios
PVD / CVD / Electroplating / Evaporating
Dry or Wet Thermal Oxide
Low Temperatore Oxide (LTO)
TEOS SiO2
LPCVD Nitride
PECVD Nitride
Polysilicon
Photoresist
Anti Sticking Layer
ITO (Indium tin oxide)

Entfernen von Rückseitenoxid Removing SiO2 from wafer back side

Removing SiO2 from wafer back side
by protecting the front side and HF-Dip

Lithography

Lithography
E-Beam
UV Nanoimprint
Optical Contact Lithography

Wafer separieren Wafer seperating

Wafer separating
for as few as only one wafer from our stock

Metrology
SEM
AFM
STM
MFM
GDMS
Type- & Resistivity- check
Ellipsometry