CMP stock polish and final polish steps finalize the processes to achieve a perfect surface quality. Chemical-mechanical polishing (CMP) is usually performed in two phases: While the initial stock polish completely removes residual surface and subsurface damages of preceding steps, the subsequent final polish minimizes the haze level by smoothing out the wafer surface. The obtained planar topology as well as roughness down to the Angstrom range fully meets today’s requirements of innovative applications.

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