Services

Grinding
Wafer thinning/Backgrindung
More information

Polishing
CMP stock polish and final polish
More information

Reclaim
Only Silicon Wafers

Special Grinding Services
such as grinding adapter pockets with smaller diameters (pocket Wafers)

Dicing
Formating Wafers into small Chips
Materials: Silicon-, Glass, Quartz, Sapphire, ...

Laser Processing
scribing, marking, cutting

Coatings
Metalizatios
PVD / CVD / Electroplating / Evaporating
Dry or Wet Thermal Oxide
Low Temperatore Oxide (LTO)
TEOS SiO2
LPCVD Nitride / PECVD Nitride
Polysilicon
Photoresist
ITO (Indium tin oxide)

Removing SiO2 from wafer back side
by protecting the front side and HF-Dip

Wafer separating
for as few as only one wafer from our stock

Metrology
SEM
AFM
Type- & Resistivity- check
Ellipsometry
Wafer geometry (E&H MX-204)
Layer Thickness (Filmetrics F50-NIR)